Advanced Materials for Thermal Management of Electronic Packaging

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dc.contributor.author Xingcun, Colin Tong
dc.date.accessioned 2019-03-07T07:32:13Z
dc.date.accessioned 2023-07-24T14:39:32Z
dc.date.available 2019-03-07T07:32:13Z
dc.date.available 2023-07-24T14:39:32Z
dc.date.issued 2011
dc.identifier.isbn 978-1-4419-7759-5
dc.identifier.uri http://196.191.116.215/handle/123456789/51786
dc.language.iso en en_US
dc.publisher Springer Science+Business Media en_US
dc.subject Springer Science+Business Media en_US
dc.title Advanced Materials for Thermal Management of Electronic Packaging en_US
dc.type Book en_US


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